3D sensing Solution

3D sensing Solution
Efficient, Effective and Essential
3D sensing Solution
3D sensing device has a compact optical size, high resolution, and robustness to cope with various environments (light stability and high temperature properties) that enables several applications.
3D sensing Solution
We provides System Development Environment for the growing 3D sensing world by collaborating with the global partners.




オートモーティブやコンシューマ用途向けに視線検知ソリューションを提供。 3次元画像を活用した彼らの先駆的なアルゴリズムは、ドライバーモニタリングやキャビンに於けるHMI用途で必要とされる 頭部位置や視線の、正確且つ堅牢なトラッキングを実現します。


機器への半導体組込み分野で、3D/2Dセンサーの使いこなし技術と人センシング技術をベースとしたセンシングソフトウェア ソリューションや、関連する組込みシステム設計/ソフトウェア設計のエンジニアリングサービスをご提供する会社

Thundercomm Technology Co., Ltd.

Thundercomm is a provider of IoT products, technologies and one-stop services for OEM/ODMs, innovative enterprises and developers in the IoT Area. Thundercomm was jointly established by Thunder Software Co., Ltd. and Qualcomm® Technologies, Inc. in 2016. With the basis of Qualcomm's world-leading SoC technology as well as ThunderSoft's powerful operating system technology and global service capability, Thundercomm is devoted to IoT products to help partners and customers accelerate the process of IoT products from the prototype to mass production. Through Thundercomm's continuous devotion to IoT, along with customers and partners, Thundercomm's goal is to be the backbone of the integrative development of "Internet Plus" strategies.

Leopard Imaging Inc.

Leopard Imaging Inc. is a global high-tech company that provides High Definition embedded cameras along with other related products. They are working very closely with NVIDIA, Intel, Xilinx and Qualcomm to provide camera solutions to these platforms and now focusing on state-of-the-art camera such as drone robotics and 3D depth camera. They will get the approval for "DRIVE-IX" which is NVIDIA's platform for In-Cabin sensing targeting high level autonomous driving.

Pico Interactive Inc.

Founded in 2015, Pico has over 300 team members with operations in the United States, Europe, China and Japan. Pico develops innovative VR and machine vision solutions, including the Pico Zense. Zense is a world-class, high-resolution Time-of-Flight (TOF) depth-sensing technology, which offers end-to-end solutions for machine vision hardware and software. Pico also provides a rich industrial base of 3D visual related capabilities to industrial users as part of development support.

Panasonic 3D sensing Solution
We provide ToF sensing techinical information. It must be useful for your selection of 3D sensing methodology for your design application.

Our ToF sensing Vision

Our ToF sensing Vision

TOF方式3Dイメージセンシングソリューションは、NIR光を使用して対象空間そのものを瞬時に測距する 事で立体的に識別する事が出来ます。従い、自動運転(Autonomous Driving)やAMR(Autonomous Mobile Robot) といった自律的に安全に動作する事が必然の用途に適しています。 また、距離だけでなく、僅かな変化や兆候を捉え、その空間に起こっている様々な事象を知ることで生まれる 価値を創出する事も出来る為、ヒューマンセンシング等の用途にも適しています。



お客様のアプリケーションに最適なToF 3Dセンシングシステムを開発出来るよう、フィッティングに向けてサポート致します。お客様のユースケースをお聞きした上で、ソリューションプランをご提案致します。


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  • Depth Viewer:
  • Enhanced Library:
“Depth Viewer” “Enhanced Library”
OS Windows10 Windows, ROS, Linux
Interface USB3.0 <-
  • Depth精度評価
  • TOFカメラ制御
  • 距離レンジ調整
  • エンハンス処理
    (NR, WDR etc.)

Other development tool

Other development tool

Easy to start developing 3D applications with ToF sensor


Qualcomm® Robotics RB5 Development Kit

Based on the Qualcomm® QRB5165 Robotics SoC, the Qualcomm® Robotics RB5 Development kit contains a robotics-focused development board and compliant with the 96Boards open hardware specification which supports a broad range of mezzanine-board expansions for rapid prototyping.

  • Contains advanced robotics platform Qualcomm® QRB5165 processor.
  • Supports widely used Linux based distributions for robotics applications.
  • Supports multiple SDKs and tools, including Qualcomm® Neural Processing SDK for AI, Qualcomm® Robotics Vision SDK, Qualcomm® Computer Vision SDK, Qualcomm® Hexagon™ DSP SDK, Robotics Operating System (ROS) 2, and multiple Linux distributions.
  • Comprehensive set of demo applications and tutorials to accelerate development of robotics applications.
  • Compliants with the 96Board, support for sensors such as multiple cameras, depth sensing solution, GMSL sensor, Ultrasonic Time-of-Flight Sensor with Extended Range, multi-mic and additional sensors like IMU, pressure sensor, magnetometer etc.
  • Multiple interfaces and I/Os which can connect multiple sensors.
3D sensing Solution
We provide ToF sensing techinical information. It must be useful for your selection of 3D sensing methodology for your design application.

Technical System for 3D Sensing

Nowadays there exists a variety of 3D sensing techniques. In order to expand the use of 3D sensing for safety and security applications, it is essential to reduce the size and cost while ensuring reliability. The non-mechanical ranging methodology provides the simplest technique and best solution to meet those requirements.

Methodology Comparison

There are three types of non-mechanical ranging.
- Structured Light: Depth is calculated by Triangulation
- Indirect ToF: Depth is calculated by the signal ratio proportional to the round trip time of light
- Direct ToF: Depth is calculated by directly measuring the round trip time of light
Each type has its own characteristics.

Ranging Area vs Application

We are currently mass-producing indirect ToF sensors, which have the highest distance accuracy in 1-to-10 m range, aiming to develop applications that provide safety and security by making human situations visible, including biometrics, skeleton detection, condition detection, and behavior prediction.
We are also pursuing the development of direct ToF sensors for a range exceeding 10 m to achieve applications that cover a longer distance.

3D sensing Solution
We will inform you about media release, event information, disclosure of technical information, and various topics.
May 31, 2019

Panasonic joined "NVIDIA GPU Technology Conference 2019"

GPU Technology Conference (GTC) hosted by NVIDIA is the premier AI and deep learning event, being held March 17-21, in San Jose, California.We demonstrated our ToF 3D sensing solution and showcase the evaluation kit for NVIDIA's Jetson Xavier, the AI embedded platform.

November 30, 2018

We showcased "Imaging LiDAR" at "electronica 2018", the solution concept using our 3D ToF Image Sensor.

"Imaging LiDAR" is an evaluation device for development that uses our 3D ToF Image Sensor based on the concept of "ambient information sensing technology for the autonomous control to achieve smart mobility".

November 2, 2018

Panasonic joined "CEATEC Japan trade show" and exhibited device technologies with a focus on sensing in order to create solutions that bring the company closer to people and society through innovation made possible by the core concept of "visualize the invisible".

Panasonic semiconductor showcased "Imaging LiDAR". This device senses the ambient information required to enable the autonomous control necessary for achieving smart mobility.

September 13, 2018

Panasonic Integrates 3D Time-of-Flight (ToF) Image Sensor with NVIDIA DRIVE

Support for NVIDIA DRIVE IX enable manufacturers to build next-generation in-cabin applications

Panasonic Semiconductor Solutions Co., Ltd. (hereinafter called "Panasonic"), which offers technologies to provide safety and security for a comfortable human life, is developing a 3D ToF image sensor, a state-of-the-art depth sensing camera solution. When coupled with the NVIDIA DRIVE car computing platform and DRIVE IX intelligent experience software, manufacturers can develop AI-based advanced driver monitoring systems.

3D sensing Solution
Should you have any questions or need more inofrmation,
please do not hesitate to contact us.
We contribute to your business innovation with our 3D sensing solution.